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10AX048H2F34I3SG - Intel

Description: 1152-pin Flip-Chip BGA

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PCB Footprints
10AX048H2F34I3SG - Intel PCB footprint - BGA - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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3D Models
10AX048H2F34I3SG - Intel  - 3D model - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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10AX048H2F34I3SG Details

  • Manufacturer Part Number:

    10AX048H2F34I3SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1152

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    34 mm

  • Number of CLBs:

    18359

  • Number of Inputs:

    492

  • Number of Logic Cells:

    480000

  • Number of Outputs:

    492

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    18359 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    34 mm

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10AX048H2F34I3SG Overview

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