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10AX048K3F35I2SG - Intel

Description: Intel Arria 10 Device FPGAs

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10AX048K3F35I2SG - Intel PCB footprint - BGA - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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3D Models
10AX048K3F35I2SG - Intel  - 3D model - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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10AX048K3F35I2SG Details

  • Manufacturer Part Number:

    10AX048K3F35I2SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1152

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of CLBs:

    18359

  • Number of Inputs:

    396

  • Number of Logic Cells:

    480000

  • Number of Outputs:

    396

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    18359 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

10AX048K3F35I2SG Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the Arria 10 FPGA family, which includes the 10AX048K3F35I2SG. The guide recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes. It also provides guidelines for signal routing, decoupling, and thermal management.
  • Intel provides a PowerPlay Early Power Estimator (EPE) tool that allows you to estimate the power consumption of your design based on the device utilization, clock frequency, and other factors. You can also use the Intel Quartus Prime software to optimize power consumption by selecting the optimal voltage, frequency, and device configuration for your design.
  • The 10AX048K3F35I2SG has a maximum junction temperature of 100°C. Intel recommends using a heat sink or thermal solution that can keep the junction temperature below 85°C for optimal performance and reliability. The FPGA also has a built-in thermal diode that can be used to monitor the die temperature.
  • Intel recommends using a reliable configuration device, such as a flash memory or an external memory device, to store the FPGA configuration data. You should also ensure that the power supply is stable and meets the FPGA's power requirements during configuration and boot-up. Additionally, you can use the Intel Quartus Prime software to generate a boot loader that can configure the FPGA and load the application code.
  • The 10AX048K3F35I2SG is designed to meet the radiation and EMC requirements for commercial and industrial applications. However, if you are designing a system for a specific industry or application that requires additional radiation or EMC testing, you should consult with Intel or a qualified third-party testing lab to ensure compliance.

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