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10AX057N3F40E2SG - Intel

Description: FPGA Arria® 10 GX Family 570000 Cells 20nm Technology 0.9V 1517-Pin FBGA

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PCB Footprints
10AX057N3F40E2SG - Intel PCB footprint - BGA - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX057N3F40E2SG - Intel  - 3D model - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.35
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10AX057N3F40E2SG Details

  • Manufacturer Part Number:

    10AX057N3F40E2SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1517

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A001.A.7.B

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.7

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1517

  • Length:

    40 mm

  • Number of CLBs:

    21708

  • Number of Inputs:

    588

  • Number of Logic Cells:

    570000

  • Number of Outputs:

    588

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Organization:

    21708 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    40 mm

10AX057N3F40E2SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX057N3F40E2SG is approximately 12W, but this can vary depending on the specific design and usage.
  • To implement a DDR3 memory interface on the 10AX057N3F40E2SG, you need to use the FPGA's external memory interface (EMIF) and follow the guidelines provided in the Intel FPGA Memory Interface Handbook.
  • Yes, the 10AX057N3F40E2SG supports high-speed serial interfaces like PCIe and SATA, and Intel provides IP cores and design examples to help implement these interfaces.
  • To optimize the 10AX057N3F40E2SG for low power consumption, use the Intel Quartus Prime Power Analyzer tool to identify power-hungry areas of your design, and then apply power reduction techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • The maximum operating frequency of the 10AX057N3F40E2SG is approximately 500 MHz, but this can vary depending on the specific design and usage.

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10AX057N3F40E2SG Overview

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