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10AX066N2F40I2LG - Intel

Description: FPGA Arria® 10 GX Family 660000 Cells 20nm Technology 0.9V Medical 1517-Pin FC-FBGA

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10AX066N2F40I2LG - Intel - PCB symbol
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PCB Footprints
10AX066N2F40I2LG - Intel PCB footprint - BGA - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX066N2F40I2LG - Intel - 3D model - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.35
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10AX066N2F40I2LG Details

  • Manufacturer Part Number:

    10AX066N2F40I2LG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1517

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1517

  • Length:

    40 mm

  • Number of CLBs:

    25168

  • Number of Inputs:

    588

  • Number of Logic Cells:

    660000

  • Number of Outputs:

    588

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    25168 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    40 mm

10AX066N2F40I2LG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX066N2F40I2LG is approximately 12W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize the 10AX066N2F40I2LG for low power consumption, use the Intel Quartus Prime Power Analyzer tool to identify power-hungry components, reduce clock frequencies, use power-gating, and implement dynamic voltage and frequency scaling.
  • The maximum operating temperature of the 10AX066N2F40I2LG is 100°C (212°F), but it's recommended to operate within the commercial temperature range of 0°C to 85°C (32°F to 185°F) for optimal performance and reliability.
  • No, the 10AX066N2F40I2LG is not a radiation-hardened device and is not suitable for use in high-radiation environments, such as space or nuclear applications.
  • The maximum data transfer rate of the 10AX066N2F40I2LG's transceivers is 12.5 Gbps, but it can be configured to support lower data rates depending on the specific application requirements.

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10AX066N2F40I2LG Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like 10AX0, or try a keyword search, such as Field Programmable Gate Arrays

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10AX066N2F40I2LG Alternates

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Part Image 10AX066N2F40E2LG Intel Corporation

Field Programmable Gate Array, 25168 CLBS, 660000-Cell, TSMC, PBGA1517
Part Image 10AX066N2F40I2LN Intel Corporation

Field Programmable Gate Array, 660000-Cell, PBGA1517
Part Image 10AX066N2F40M2LG Intel Corporation

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Part Image 10AX066N2F40E2LG Altera Corporation

Field Programmable Gate Array, 660000-Cell, CMOS, PBGA1517
Part Image 10AX066N2F40E2LP Intel Corporation

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For a full list of alternate parts for 10AX066N2F40I2LG, check out Findchips.com