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10AX115N2F40E2LG - Intel

Description: Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 68857856 1150000 1517-BBGA, FCBGA

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PCB Footprints
10AX115N2F40E2LG - Intel PCB footprint - BGA - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.50
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3D Models
10AX115N2F40E2LG - Intel  - 3D model - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.50
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10AX115N2F40E2LG Details

  • Manufacturer Part Number:

    10AX115N2F40E2LG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1517

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1517

  • Length:

    40 mm

  • Number of CLBs:

    42720

  • Number of Inputs:

    600

  • Number of Logic Cells:

    1150000

  • Number of Outputs:

    600

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Organization:

    42720 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    40 mm

10AX115N2F40E2LG Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the 10AX115N2F40E2LG FPGA, which includes recommendations for PCB layout, stackup, and signal routing to ensure optimal signal integrity. The guide can be found on Intel's website.
  • Intel provides a power management guide for the 10AX115N2F40E2LG FPGA, which includes recommendations for power supply design, voltage regulation, and thermal management. Additionally, Intel's PowerPlay Early Power Estimator (EPE) tool can be used to estimate power consumption and optimize power management.
  • Intel provides a clocking and PLL user guide for the 10AX115N2F40E2LG FPGA, which includes recommendations for clocking architecture, PLL configuration, and clock domain crossing. The guide can be found on Intel's website.
  • Intel provides a configuration and boot user guide for the 10AX115N2F40E2LG FPGA, which includes recommendations for configuration modes, boot mechanisms, and error detection and correction. The guide can be found on Intel's website.
  • Intel provides a high-speed transceiver user guide for the 10AX115N2F40E2LG FPGA, which includes recommendations for transceiver configuration, signal integrity, and channel bonding. The guide can be found on Intel's website.

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10AX115N2F40E2LG Overview

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