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10CL010YM164C6G - Intel

Description: FPGA - Field Programmable Gate Array

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PCB Footprints
10CL010YM164C6G - Intel PCB footprint - BGA - BGA - 164-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond - A:1.20
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3D Models
10CL010YM164C6G - Intel  - 3D model - BGA - 164-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond - A:1.20
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10CL010YM164C6G Details

  • Manufacturer Part Number:

    10CL010YM164C6G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    MBGA-164

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B164

  • Length:

    8 mm

  • Number of CLBs:

    645

  • Number of Inputs:

    101

  • Number of Outputs:

    101

  • Number of Terminals:

    164

  • Operating Temperature-Max:

    85 °C

  • Organization:

    645 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA164,15X15,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

10CL010YM164C6G Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the 10CL010YM164C6G FPGA, which recommends a 4-layer or 6-layer PCB stackup with specific layer assignments and spacing. Additionally, Intel suggests following the PCIe and DDR3/DDR4 memory interface layout guidelines for optimal signal integrity.
  • To optimize power consumption, Intel recommends using the PowerPlay power analysis tool to estimate power consumption and identify areas for optimization. For thermal management, Intel suggests using a heat sink or thermal interface material, and ensuring good airflow around the FPGA. The datasheet also provides thermal resistance and junction-to-ambient temperature specifications.
  • The high-speed transceivers in the 10CL010YM164C6G FPGA have specific limitations and considerations, such as transmitter and receiver equalization, clocking and synchronization, and channel bonding. Intel provides guidelines and recommendations for using these transceivers in the datasheet and user manuals.
  • To ensure reliable and secure booting, Intel recommends using a secure boot mechanism, such as the FPGA's built-in boot ROM or a external boot device. Additionally, Intel suggests implementing cryptographic authentication and encryption, and using a trusted platform module (TPM) or secure key storage.
  • Intel recommends using the Intel Quartus Prime software for design development, simulation, and debugging. Additionally, Intel suggests using the FPGA's built-in debugging tools, such as the Signal Tap logic analyzer and the System Console. It's also important to follow a structured testing methodology, including unit testing, integration testing, and system-level testing.

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10CL010YM164C6G Overview

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