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10CL040ZU484I7G - Intel

Description: Cyclone10 Standard voltage (1.2 V) UBGA Package Type 484 pins BGA

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PCB Footprints
10CL040ZU484I7G - Intel PCB footprint - BGA - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond -A:2.05
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3D Models
10CL040ZU484I7G - Intel  - 3D model - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond -A:2.05
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10CL040ZU484I7G Details

  • Manufacturer Part Number:

    10CL040ZU484I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    UBGA-484

  • HTS Code:

    8542.31.00.60

  • Date Of Intro:

    2020-05-21

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9

  • Additional Feature:

    -40 TO 125 TEMPERATURE RANGE IS AVAILABLE AS EXTENDED INDUSTRIAL

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Number of CLBs:

    2475

  • Number of Inputs:

    325

  • Number of Logic Cells:

    39600

  • Number of Outputs:

    325

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2475 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.05 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

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10CL040ZU484I7G Overview

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