-40 TO 125 TEMPERATURE RANGE IS AVAILABLE AS EXTENDED INDUSTRIAL
JESD-30 Code:
S-PBGA-B484
Length:
23 mm
Number of CLBs:
3491
Number of Inputs:
321
Number of Logic Cells:
55856
Number of Outputs:
321
Number of Terminals:
484
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Organization:
3491 CLBS
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA484,22X22,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max:
2.4 mm
Supply Voltage-Max:
1.03 V
Supply Voltage-Min:
0.97 V
Supply Voltage-Nom:
1 V
Surface Mount:
YES
Technology:
60 nm
Temperature Grade:
INDUSTRIAL
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Width:
23 mm
10CL055ZF484I8G Frequently Asked Questions (FAQs)
Intel provides a PCB design guide for the 10CL055ZF484I8G, which recommends a 4-6 layer stackup with a minimum of 2 mil trace width and 2 mil spacing. Additionally, Intel suggests using a high-speed PCB material with a dielectric constant of 3.5-4.5.
Intel recommends a power supply design with multiple voltage rails, including 1.0V, 1.2V, and 3.3V. A minimum of 10uF decoupling capacitance per power pin is recommended, with a total capacitance of 100uF or more per rail. Additionally, Intel suggests using a power supply with low output impedance and high current capability.
The 10CL055ZF484I8G has a maximum junction temperature of 100°C. Intel recommends using a heat sink with a thermal resistance of 10°C/W or less, and ensuring good airflow around the device. Additionally, Intel suggests using thermal interface material (TIM) with a thermal conductivity of 1 W/m-K or higher.
Intel recommends using a reliable configuration interface, such as JTAG or PCIe, and ensuring that the configuration data is error-free and correctly formatted. Additionally, Intel suggests using a configuration clock frequency of 50 MHz or less, and ensuring that the FPGA is properly powered and reset before configuration.
Intel recommends following good EMC and EMI design practices, including using shielding, filtering, and grounding techniques to minimize radiation and susceptibility. Additionally, Intel suggests using a PCB design with a solid ground plane and minimizing the use of vias and stubs.
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10CL055ZF484I8G Overview
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