10CL080YF780I7G footprint, schematic symbol and 3D model by Intel

Symbol

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PCB Footprints

10CL080YF780I7G - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40

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3D Models

10CL080YF780I7G - Intel - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40

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Datasheet Download Datasheet
Stock & Prices Price & Stock for 10CL080YF780I7G
Part Number 10CL080YF780I7G
Manufacturer Intel
Pin Count 780
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
Released Date Jun 1, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

10CL080YF780I7G Details

Manufacturer Part Number:
10CL080YF780I7G
Rohs Code:
Yes
Part Life Cycle Code:
Transferred
Package Description:
FBGA-780
Country Of Origin:
Mainland China, Malaysia, Taiwan, USA, Vietnam
ECCN Code:
3A991
HTS Code:
8542.39.00.01
Manufacturer:
Intel Corporation
YTEOL:
9.1
JESD-30 Code:
S-PBGA-B780
Length:
29 mm
Number of CLBs:
5079
Number of Inputs:
423
Number of Outputs:
423
Number of Terminals:
780
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Organization:
5079 CLBS
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA780,28X28,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max:
2.4 mm
Supply Voltage-Max:
1.25 V
Supply Voltage-Min:
1.15 V
Supply Voltage-Nom:
1.2 V
Surface Mount:
YES
Technology:
60 nm
Temperature Grade:
INDUSTRIAL
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Width:
29 mm

10CL080YF780I7G Frequently Asked Questions (FAQs)

The maximum power consumption of the 10CL080YF780I7G is approximately 2.5W, but this can vary depending on the specific application and usage.
To implement a CDC in the 10CL080YF780I7G, you can use the Intel FPGA IP Catalog to generate a CDC module, or use a third-party IP core. You can also use the FPGA's built-in clock management features to synchronize clocks across domains.
The maximum frequency of the 10CL080YF780I7G depends on the specific application and usage, but it can operate at frequencies up to 500 MHz.
To optimize the 10CL080YF780I7G for low power consumption, you can use Intel's PowerPlay power analysis tool to identify areas of high power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
The 10CL080YF780I7G has a total of 780 I/O pins, but the maximum number of available I/O pins depends on the specific package and configuration.

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10CL080YF780I7G Overview

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10CL080YF780I7G - Intel

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