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10CL120ZF484I8G - Intel

Description: FPGA Cyclone® 10 LP Family 119088 Cells 484-Pin FBGA Tray

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PCB Footprints
10CL120ZF484I8G - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.4
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10CL120ZF484I8G - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.4
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10CL120ZF484I8G Details

  • Manufacturer Part Number:

    10CL120ZF484I8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2020-05-21

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9

  • Additional Feature:

    -40 TO 125 TEMPERATURE RANGE IS AVAILABLE AS EXTENDED INDUSTRIAL

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Number of CLBs:

    7443

  • Number of Inputs:

    525

  • Number of Logic Cells:

    119088

  • Number of Outputs:

    525

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7443 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

10CL120ZF484I8G Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the 10CL120ZF484I8G, which recommends a 4-6 layer stackup with a minimum of 2 mil trace width and 2 mil spacing. Additionally, it's essential to follow the signal integrity guidelines for high-speed signals, such as using differential pairs, and to minimize vias and layer transitions.
  • To optimize power consumption, use the Intel Power Estimator tool to estimate power consumption based on your design. Implement power-saving techniques like clock gating, dynamic voltage and frequency scaling, and use the lowest possible voltage and frequency for your application. For thermal management, ensure good airflow, use a heat sink, and consider using a thermal interface material.
  • The 10CL120ZF484I8G has 24 transceivers, each capable of up to 10 Gbps. However, there are limitations on the number of transceivers that can be used simultaneously, and the FPGA's power consumption increases with transceiver usage. Additionally, transceiver calibration and equalization are critical for reliable data transmission, and Intel provides guidelines for transceiver configuration and optimization.
  • To ensure reliable configuration and boot, use a robust configuration scheme, such as using a flash memory device or a configuration device like the Intel MAX 10. Implement a power-on reset (POR) circuit to ensure the FPGA is properly reset during power-up. Additionally, use the Intel Quartus Prime software to generate a configuration file and follow the recommended configuration sequence.
  • To implement a reliable DDR4 memory interface, follow Intel's guidelines for DDR4 interface implementation, including using the recommended PCB layout, signal integrity guidelines, and termination schemes. Use the Intel DDR4 IP core and follow the recommended calibration and training procedures to ensure reliable data transfer.

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