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10M02DCU324I7G - Intel

Description: FPGA MAX 10 Family 2000 Cells 55nm Technology 1.2V 324-Pin UFBGA

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PCB Footprints
10M02DCU324I7G - Intel PCB footprint - BGA - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.55
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3D Models
10M02DCU324I7G - Intel  - 3D model - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.55
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10M02DCU324I7G Details

  • Manufacturer Part Number:

    10M02DCU324I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    125

  • Number of Inputs:

    246

  • Number of Logic Cells:

    2000

  • Number of Outputs:

    246

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

10M02DCU324I7G Frequently Asked Questions (FAQs)

  • The maximum junction temperature for the 10M02DCU324I7G is 100°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal when the voltage is below a certain threshold. The FPGA's POR signal can be connected to the voltage supervisor's output.
  • A good PCB layout and routing strategy for the 10M02DCU324I7G involves using a multi-layer board with a solid ground plane, placing decoupling capacitors close to the FPGA's power pins, and using controlled impedance routing for high-speed signals. Intel provides a PCB design guide for this FPGA, which should be consulted for more detailed information.
  • Optimizing timing closure for the 10M02DCU324I7G involves using Intel's Quartus II software to analyze and optimize the design's timing. This can be done by using the software's built-in timing analysis tools, such as the TimeQuest timing analyzer, and applying optimization techniques such as pipelining, retiming, and register duplication.
  • The recommended settings for the 10M02DCU324I7G's clock management involve using the FPGA's internal clock management blocks, such as the PLL and clock divider, to generate the required clock frequencies. The clock frequency and phase should be set according to the specific application requirements, and the clock signal should be routed using a controlled impedance path to minimize jitter and skew.

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