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10M04SCE144I7G - Intel

Description: FPGA - Field Programmable Gate Array non-volatile FPGA, 101 I/O, 144EQFP

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10M04SCE144I7G - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin  (EQFP)
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10M04SCE144I7G - Intel  - 3D model - Quad Flat Packages - 144-Pin  (EQFP)
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10M04SCE144I7G Details

  • Manufacturer Part Number:

    10M04SCE144I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    QFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    250

  • Number of Inputs:

    246

  • Number of Logic Cells:

    4000

  • Number of Outputs:

    246

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    250 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

10M04SCE144I7G Frequently Asked Questions (FAQs)

  • The maximum junction temperature for the 10M04SCE144I7G is 100°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • To implement a clock domain crossing in the 10M04SCE144I7G, you can use Intel's recommended CDC techniques, such as using synchronizers, FIFOs, or handshake signals. You can also use Intel's IP cores, such as the CDC IP, to simplify the implementation.
  • The power consumption of the 10M04SCE144I7G depends on the specific use case and design implementation. However, according to the datasheet, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 1.5W to 3.5W, depending on the clock frequency and activity factor.
  • Yes, the 10M04SCE144I7G is suitable for high-reliability applications. Intel provides a range of resources and tools to support the development of high-reliability designs, including radiation-hardened IP cores, fault-tolerant design flows, and reliability analysis tools.
  • To optimize timing closure on the 10M04SCE144I7G, you can use Intel's Quartus Prime software, which provides a range of tools and features, such as timing analysis, clock domain crossing analysis, and physical synthesis. You can also use Intel's recommended design flows and best practices to improve timing closure.

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