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10M08SAM153A7G - Intel

Description: FPGA - Field Programmable Gate Array, 2.85 V/3.135 V

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PCB Footprints
10M08SAM153A7G - Intel PCB footprint - BGA - BGA - 153-Pin Micro FineLine Ball-Grid Array (MBGA)_2026
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3D Models
10M08SAM153A7G - Intel  - 3D model - BGA - 153-Pin Micro FineLine Ball-Grid Array (MBGA)_2026
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10M08SAM153A7G Details

  • Manufacturer Part Number:

    10M08SAM153A7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    MBGA-153

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B153

  • Length:

    8 mm

  • Number of CLBs:

    500

  • Number of Inputs:

    250

  • Number of Logic Cells:

    8000

  • Number of Outputs:

    250

  • Number of Terminals:

    153

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA153,15X15,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

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10M08SAM153A7G Overview

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Part Image 10M08SAM153A7 Intel Corporation

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Part Image 10M08SAM153A7G Altera Corporation

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Part Image 10M08SAM153A7 Altera Corporation

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