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10M08SAM153C8G - Intel

Description: FPGA MAX 10 Family 8000 Cells 55nm Technology 1.2V 153-Pin MBGA Tray

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PCB Footprints
10M08SAM153C8G - Intel PCB footprint - BGA - BGA - 153-Pin Micro FineLine Ball-Grid Array (MBGA) – Wire Bond - A:1.00
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3D Models
10M08SAM153C8G - Intel  - 3D model - BGA - 153-Pin Micro FineLine Ball-Grid Array (MBGA) – Wire Bond - A:1.00
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10M08SAM153C8G Details

  • Manufacturer Part Number:

    10M08SAM153C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B153

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    500

  • Number of Inputs:

    250

  • Number of Logic Cells:

    8000

  • Number of Outputs:

    250

  • Number of Terminals:

    153

  • Operating Temperature-Max:

    85 °C

  • Organization:

    500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA153,15X15,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

10M08SAM153C8G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M08SAM153C8G is -40°C to 100°C.
  • To implement a CDC in the 10M08SAM153C8G, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated.
  • The maximum frequency achievable with the 10M08SAM153C8G depends on the specific design and implementation, but it can reach up to 350 MHz.
  • To optimize power consumption, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • Yes, the 10M08SAM153C8G is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its robust design and manufacturing process.

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10M08SAM153C8G Overview

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