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10M08SCE144I7G - Intel

Description: FPGA - Field Programmable Gate Array non-volatile FPGA, 101 I/O, 144EQFP

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10M08SCE144I7G - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.0
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10M08SCE144I7G - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.0
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for 10M08SCE144I7G
  • Part Number 10M08SCE144I7G
  • Manufacturer Intel
  • Pin Count 145
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.0
  • Released Date Dec 25, 2018
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

10M08SCE144I7G Details

  • Manufacturer Part Number:

    10M08SCE144I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    QFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    500

  • Number of Inputs:

    250

  • Number of Logic Cells:

    8000

  • Number of Outputs:

    250

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

10M08SCE144I7G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M08SCE144I7G is -40°C to 100°C.
  • To implement a CDC in the 10M08SCE144I7G, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated.
  • The recommended power-on sequence for the 10M08SCE144I7G is to power up the core voltage (VCC) first, followed by the auxiliary voltage (VCCAUX), and then the input/output voltage (VCCIO).
  • To optimize timing closure for the 10M08SCE144I7G, use the Intel Quartus Prime software to analyze and optimize the design, and consider using techniques such as pipelining, retiming, and clock gating.
  • The maximum current draw for the 10M08SCE144I7G depends on the specific configuration and operating conditions, but the typical current draw is around 1.5A for the core voltage (VCC) and 0.5A for the auxiliary voltage (VCCAUX).

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