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10M16SCU324C8G - Intel

Description: FPGA MAX 10 Family 16000 Cells 55nm Technology 1.2V 324-Pin UBGA

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PCB Footprints
10M16SCU324C8G - Intel PCB footprint - BGA - BGA - UBGA 324
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3D Models
10M16SCU324C8G - Intel  - 3D model - BGA - UBGA 324
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10M16SCU324C8G Details

  • Manufacturer Part Number:

    10M16SCU324C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    15 mm

  • Number of CLBs:

    1000

  • Number of Inputs:

    320

  • Number of Logic Cells:

    16000

  • Number of Outputs:

    320

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

10M16SCU324C8G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M16SCU324C8G is -40°C to 100°C.
  • To implement a CDC in the 10M16SCU324C8G, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.
  • The maximum frequency achievable with the 10M16SCU324C8G depends on the specific design and implementation, but Intel's Quartus II software can help estimate the maximum frequency based on the design's complexity and resource utilization.
  • To optimize power consumption in the 10M16SCU324C8G, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling, and leverage Intel's PowerPlay power analysis and optimization tools.
  • The 10M16SCU324C8G can be configured using JTAG, AS, or PS mode, and can also be configured using external configuration devices such as EPCQ or EPCQ-L.

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10M16SCU324C8G Overview

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Part Image 10M16SCU324C8P Intel Corporation

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Part Image 10M16SCU324I8G Intel Corporation

Field Programmable Gate Array, 1000 CLBS, 16000-Cell, TSMC, PBGA324