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10M40DCF256I7G - Intel

Description: FPGA MAX 10 Family 40000 Cells 55nm Technology 1.2V 256-Pin TFBGA

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PCB Footprints
10M40DCF256I7G - Intel PCB footprint - BGA - BGA - 256-FBGA (17x17)
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10M40DCF256I7G - Intel  - 3D model - BGA - 256-FBGA (17x17)
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10M40DCF256I7G Details

  • Manufacturer Part Number:

    10M40DCF256I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2500

  • Number of Inputs:

    500

  • Number of Logic Cells:

    40000

  • Number of Outputs:

    500

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

10M40DCF256I7G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M40DCF256I7G is -40°C to 100°C.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal to the FPGA.
  • A good PCB layout and routing strategy for the 10M40DCF256I7G involves using a multi-layer PCB, separating analog and digital signals, and using controlled impedance routing for high-speed signals.
  • Optimizing timing closure involves using the Intel Quartus Prime software to analyze and optimize the design, using techniques such as pipelining, retiming, and clock domain crossing.
  • The recommended decoupling capacitor values for the 10M40DCF256I7G are 0.1uF and 10uF, placed as close as possible to the FPGA's power pins.

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10M40DCF256I7G Overview

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