10M50DAF256I7 - Intel

10M50DAF256I7 Details

• Manufacturer Part Number:

  10M50DAF256I7

• Part Life Cycle Code:

  Active

• Package Description:

  17 X 17 MM, 1 MM PITCH, FBGA-256

• HTS Code:

  8542.31.00.60

• Manufacturer:

  Intel Corporation

• YTEOL:

  7

• JESD-30 Code:

  S-PBGA-B256

• Length:

  17 mm

• Number of Inputs:

  178

• Number of Logic Cells:

  50000

• Number of Outputs:

  178

• Number of Terminals:

  256

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  3125 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA256,16X16,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Seated Height-Max:

  1.55 mm

• Supply Voltage-Max:

  1.25 V

• Supply Voltage-Min:

  1.15 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  55 nm

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  17 mm