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10M50DAF256I7G - Intel

Description: FPGA MAX 10 Family 50000 Cells 55nm Technology 1.2V 256-Pin TFBGA

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PCB Footprints
10M50DAF256I7G - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA)
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3D Models
10M50DAF256I7G - Intel  - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA)
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10M50DAF256I7G Details

  • Manufacturer Part Number:

    10M50DAF256I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    3125

  • Number of Inputs:

    500

  • Number of Logic Cells:

    50000

  • Number of Outputs:

    500

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

10M50DAF256I7G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M50DAF256I7G is -40°C to 100°C.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal to the FPGA.
  • A good PCB layout and routing strategy for the 10M50DAF256I7G involves using a multi-layer PCB, separating analog and digital signals, and using differential pairs for high-speed signals. Intel provides a PCB design guide for this FPGA.
  • To optimize timing closure, use the Intel Quartus Prime software to analyze the design's timing requirements, and then apply timing constraints, such as clock domain crossing (CDC) and false path constraints, to ensure that the design meets the required timing margins.
  • The recommended decoupling capacitor values for the 10M50DAF256I7G are 0.1 μF and 10 μF, placed as close as possible to the FPGA's power pins, with the 0.1 μF capacitor being the closest to the pin.

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10M50DAF256I7G Overview

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Part Image 10M50DAF256I7P Intel Corporation

Field Programmable Gate Array, 3125 CLBS, 50000-Cell, PBGA256

Part Image 10M50DAF256A7P Intel Corporation

Field Programmable Gate Array, 3125 CLBS, 50000-Cell, PBGA256

Part Image 10M50DAF256I7G Altera Corporation

Field Programmable Gate Array, 50000-Cell, CMOS, PBGA256

Part Image 10M50DAF256C7G Altera Corporation

Field Programmable Gate Array, 50000-Cell, CMOS, PBGA256

Part Image 10M50DAF256A7 Intel Corporation

Field Programmable Gate Array, 3125 CLBS, PBGA256

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