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10M50SAE144I7G - Intel

Description: FPGA - Field Programmable Gate Array

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PCB Footprints
10M50SAE144I7G - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - (144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:8.93)
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3D Models
10M50SAE144I7G - Intel  - 3D model - Quad Flat Packages - (144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:8.93)
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for 10M50SAE144I7G
  • Part Number 10M50SAE144I7G
  • Manufacturer Intel
  • Pin Count 145
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - (144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:8.93)
  • Released Date Feb 14, 2018
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

10M50SAE144I7G Details

  • Manufacturer Part Number:

    10M50SAE144I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    3125

  • Number of Inputs:

    500

  • Number of Logic Cells:

    50000

  • Number of Outputs:

    500

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    HQFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

10M50SAE144I7G Frequently Asked Questions (FAQs)

  • The maximum junction temperature for the 10M50SAE144I7G is 100°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • To implement a clock domain crossing in the 10M50SAE144I7G, you can use Intel's recommended CDC techniques, such as using synchronizers, FIFOs, or asynchronous FIFOs. You can also use the Intel Quartus Prime software to implement CDCs using the 'clock domain crossing' IP core.
  • The power consumption of the 10M50SAE144I7G depends on the specific use case and design implementation. However, according to the datasheet, the typical power consumption is around 1.2W for the entire device. You can use Intel's PowerPlay Early Power Estimator (EPE) tool to estimate the power consumption of your design.
  • Yes, the 10M50SAE144I7G is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems. It has been designed and tested to meet the requirements of these applications, including radiation tolerance and fault tolerance.
  • To implement a secure boot mechanism in the 10M50SAE144I7G, you can use Intel's Secure Boot IP core, which provides a secure boot process that ensures the authenticity and integrity of the FPGA's configuration data. You can also use other security features, such as encryption and secure key storage.

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