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10SEP330M+TSS - Panasonic

Description: Panasonic 330µF 10V dc Aluminium Electrolytic Capacitor, Through Hole 8 x 12mm +105°C 8mm 3.5mm 12mm

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10SEP330M+TSS - Panasonic - PCB symbol
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PCB Footprints
10SEP330M+TSS - Panasonic PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - e12
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3D Models
10SEP330M+TSS - Panasonic - 3D model - Capacitor, Polarized Radial Diameter - e12
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10SEP330M+TSS Details

  • Manufacturer Part Number:

    10SEP330M+TSS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ-300KHZ

  • Capacitance:

    330 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    8 mm

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    17 mΩ

  • Leakage Current:

    0.66 mA

  • Length:

    12 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    AMMO PACK

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    10 V

  • Ripple Current:

    197.5 mA

  • Surface Mount:

    NO

  • Tan Delta:

    0.15

  • Terminal Pitch:

    3.5 mm

  • Terminal Shape:

    WIRE

10SEP330M+TSS Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 10SEP330M+TSS can be found in the Panasonic Electronic Components' recommended footprint document or by contacting their technical support. A general guideline is to follow the IPC-7351 standard for QFN packages.
  • The thermal pad should be connected to a solid ground plane on the PCB to ensure good thermal dissipation. A thermal via array can be used to connect the thermal pad to the ground plane. During assembly, a thermal interface material (TIM) can be applied to the thermal pad to improve heat transfer.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to consider the application's specific requirements and potential thermal gradients. It's recommended to consult with Panasonic's technical support or application notes for more detailed information.
  • The 10SEP330M+TSS is a surface-mount device, and its reliability in high-vibration environments depends on the PCB design, assembly, and mounting. It's recommended to follow Panasonic's guidelines for vibration testing and to consult with their technical support for specific application requirements.
  • Follow the recommended soldering profile and temperature guidelines provided in the datasheet. Ensure the PCB is designed with a suitable solder mask and that the assembly process uses a suitable solder paste and reflow profile. Visual inspection and X-ray inspection can be used to verify the solder joints.

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10SEP330M+TSS Overview

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