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115I-AEAA - ATTEND

Description: Connector Micro SIM Card Push-Pull 6P SMD

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PCB Footprints
115I-AEAA - ATTEND PCB footprint - Other - Other - 115I-AEAA-4
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3D Models
115I-AEAA - ATTEND  - 3D model - Other - 115I-AEAA-4
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115I-AEAA Details

  • Manufacturer Part Number:

    115I-AEAA

  • Part Life Cycle Code:

    Contact Manufacturer

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Manufacturer:

    Attend Technology Inc

  • Board Mounting Option:

    SOLDER HOLD DOWN

  • Body Breadth:

    0.055 inch

  • Body Depth:

    0.599 inch

  • Body Length:

    0.57 inch

  • Body/Shell Style:

    SOCKET

  • Connector Type:

    PCB CONNECTOR

  • Contact Gender:

    FEMALE

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    100 mΩ

  • Contact Style:

    BELLOWED TYPE

  • Dielectric Withstanding Voltage:

    500VAC V

  • Filter Feature:

    NO

  • Insertion Force-Max:

    10 N

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Color:

    BLACK

  • Insulator Material:

    LIQUID CRYSTAL POLYMER

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    2

  • Number of Rows Loaded:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Option:

    GENERAL PURPOSE

  • PCB Contact Pattern:

    RECTANGULAR

  • PCB Contact Row Spacing:

    7.62 mm

  • Plating Thickness:

    15u inch

  • Polarization Key:

    POLARIZED HOUSING

  • Rated Current (Signal):

    0.5 A

  • Reference Standard:

    UL

  • Terminal Pitch:

    2.54 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    6

  • UL Flammability Code:

    94V-0

  • Withdrawl Force-Min:

    0.5 N

115I-AEAA Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply power to the VCC pin first, followed by the VEE pin. This ensures proper initialization of the internal circuitry.
  • The thermal shutdown feature is activated when the junction temperature exceeds 150°C. To handle this, ensure proper heat sinking, reduce power consumption, or implement a thermal monitoring system to prevent overheating.
  • The maximum capacitive load that the 115I-AEAA can drive is 100 pF. Exceeding this limit may cause instability or oscillations in the output signal.
  • While the 115I-AEAA is a high-quality component, it is not specifically designed for high-reliability or aerospace applications. For such applications, consider using components with specific certifications, such as MIL-STD-883 or NASA-approved components.
  • To troubleshoot issues with the output signal, check the input signal quality, ensure proper power supply and ground connections, and verify that the device is operated within its specified temperature range. Use an oscilloscope to analyze the output signal and identify any anomalies.

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