1206SFF200F/63-2 footprint, schematic symbol and 3D model by LITTELFUSE

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1206SFF200F/63-2 Details

The recommended PCB footprint for the 1206SFF200F/63-2 is a rectangular pad with dimensions of 1.55mm x 3.05mm, with a 0.5mm radius corner and a 0.25mm spacing between pads.
The 1206SFF200F/63-2 is rated for operation up to 125°C, but it's recommended to derate the fuse's current rating by 1.5% per degree Celsius above 85°C to ensure reliable operation.
To prevent damage, use a soldering iron with a temperature below 260°C and avoid applying excessive force or pressure during rework. Also, ensure the fuse is not exposed to soldering temperatures for more than 3 seconds.
Yes, the 1206SFF200F/63-2 is compatible with lead-free soldering processes, but it's essential to follow the recommended soldering profile to prevent damage.
Store the 1206SFF200F/63-2 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the fuse by the body, avoiding touching the terminations to prevent damage or contamination.

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