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12TPG33M - Panasonic

Description: NRFND, Rated Voltage (V): 12.5, Capacitance (?F): 33, Tolerance on Capacitance (%): +/-20, Category Temperature Range (°C): -55 to 105, Endurance@Temp: 1000h@85°C, Rated Ripple Current (mArms): 1000, Rated Ripple Current (temp.) (°C): 45, Rated Ripple Current (freq.) (kHz): 100, ESR (m?): 70, ESR Frequency (kHz): 100, Leakage Current [Max.] (?A): 41.3, Dissipation Factor [Max.]: 0.1, Body Length (mm): 3.5, Body Width (mm): 2.8, Body Height (mm): 1.1, Size Code: B1G

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Symbol
12TPG33M - Panasonic - PCB symbol
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PCB Footprints
12TPG33M - Panasonic PCB footprint - Other - Other - B1G
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3D Models
12TPG33M - Panasonic - 3D model - Other - B1G
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12TPG33M Details

  • Manufacturer Part Number:

    12TPG33M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    0

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ, RIPPLE CURRENT IS MEASURED AT 100KHZ AND 45CEL

  • Capacitance:

    33 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (SOLID POLYMER)

  • ESR:

    70 mΩ

  • Height:

    1.1 mm

  • Leakage Current:

    0.0413 mA

  • Length:

    3.5 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, Embossed, 7 Inch

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    12.5 V

  • Ripple Current:

    1000 mA

  • Size Code:

    1411

  • Surface Mount:

    YES

  • Tan Delta:

    0.1

  • Terminal Shape:

    J BEND

  • Width:

    2.8 mm

12TPG33M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 12TPG33M is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask opening of 2.2mm x 1.2mm.
  • The 12TPG33M has a thermal resistance of 10°C/W, so it's recommended to use a heat sink or a thermal pad to dissipate heat. A copper plane or a thermal via can also be used to improve heat dissipation.
  • The maximum operating temperature range for the 12TPG33M is -40°C to 125°C, but it's recommended to operate it within -20°C to 85°C for optimal performance and reliability.
  • Yes, the 12TPG33M is designed to withstand high vibrations and can operate in environments with vibrations up to 10G.
  • To ensure reliability in a humid environment, it's recommended to use a moisture-resistant coating or conformal coating on the PCB, and to follow proper storage and handling procedures to prevent moisture absorption.

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12TPG33M Overview

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