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15311R-1000 - Renesas Electronics

Description: The PL 3120 Power Line Smart Transceiver integrates a Neuron processor core with a power line transceiver, making it ideal for appliance, audio/video, lighting, heating/cooling, security, metering, and irrigation applications. A complete system-on-a-chip, the PL 3120 features a highly reliable narrow-band power line transceiver, an 8-bit Neuron processor core for running applications and managing network communications, on-board memory, and an extremely small form factor – all at a price that is compelling

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15311R-1000 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 38 TSSOP
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15311R-1000 - Renesas Electronics  - 3D model - Small Outline Packages - 38 TSSOP
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15311R-1000 Details

  • Manufacturer Part Number:

    15311R-1000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSSOP-38

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G38

  • Length:

    9.7 mm

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

15311R-1000 Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • Renesas recommends using a heat sink with a thermal resistance of 10°C/W or lower, and ensuring good airflow around the device. Additionally, consider using a thermal interface material with a thermal conductivity of 1 W/m-K or higher.
  • Renesas recommends using a 10uF to 22uF X7R or X5R ceramic capacitor with a voltage rating of 25V or higher, placed as close to the VIN pin as possible.
  • Renesas recommends using a 2nd-order LC filter with a 1uH inductor and a 10uF capacitor, and placing the filter components as close to the output pin as possible. The filter should be designed to attenuate noise above 100 kHz.
  • Renesas recommends applying the input voltage (VIN) first, followed by the enable signal (EN). The output voltage (VOUT) should be monitored to ensure it reaches the desired level before connecting the load.

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