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15KPA066C-SD-Q - Bourns

Description: 96.9V Clamp 143.3A Ipp Tvs Diode Surface Mount DO-218

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Symbol
15KPA066C-SD-Q - Bourns - PCB symbol
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PCB Footprints
15KPA066C-SD-Q - Bourns PCB footprint - Other - Other - DO-218_2026-3.3
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3D Models
15KPA066C-SD-Q - Bourns - 3D model - Other - DO-218_2026-3.3
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15KPA066C-SD-Q Details

  • Manufacturer Part Number:

    15KPA066C-SD-Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    14 Weeks

  • Date Of Intro:

    2019-10-17

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.86

  • Additional Feature:

    PD-CASE

  • Breakdown Voltage-Max:

    80 V

  • Breakdown Voltage-Min:

    66.4 V

  • Breakdown Voltage-Nom:

    73.2 V

  • Clamping Voltage-Max:

    96.9 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-218

  • JESD-30 Code:

    R-PSSO-C1

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    15000 W

  • Number of Elements:

    1

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    8 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    66 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    66 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

15KPA066C-SD-Q Frequently Asked Questions (FAQs)

  • Bourns recommends a specific PCB layout and land pattern to ensure optimal performance and minimize parasitic inductance. It's essential to follow the recommended layout to achieve the specified performance. Contact Bourns for more information.
  • The 15KPA066C-SD-Q is designed to handle high-frequency switching conditions. However, the device's behavior under these conditions may vary depending on the specific application and circuit design. It's recommended to consult with Bourns' application engineers for customized guidance.
  • Proper thermal management is crucial for the 15KPA066C-SD-Q. Ensure adequate heat sinking, and follow the recommended thermal design guidelines to prevent overheating and ensure reliable operation.
  • Yes, the 15KPA066C-SD-Q is designed to meet specific EMI/EMC standards. However, it's essential to follow proper PCB design and layout practices to minimize EMI/EMC issues. Consult with Bourns' application engineers for customized guidance.
  • To prevent damage and ensure reliability, follow proper storage and handling procedures for the 15KPA066C-SD-Q, including electrostatic discharge (ESD) protection and moisture-sensitive device handling.

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15KPA066C-SD-Q Overview

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