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16SEP150M+T - Panasonic

Description: Panasonic 150μF 16 V Polymer Aluminium Electrolytic Capacitor F8, OSCON SEP Series 3000h 10 x 8mm

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16SEP150M+T - Panasonic - PCB symbol
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PCB Footprints
16SEP150M+T - Panasonic PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - F8
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3D Models
16SEP150M+T - Panasonic - 3D model - Capacitor, Polarized Radial Diameter - F8
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16SEP150M+T Details

  • Manufacturer Part Number:

    16SEP150M+T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ-300KHZ

  • Capacitance:

    150 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    10 mm

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    30 mΩ

  • Leakage Current:

    0.48 mA

  • Length:

    8 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    AMMO PACK

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    16 V

  • Ripple Current:

    151 mA

  • Surface Mount:

    NO

  • Tan Delta:

    0.12

  • Terminal Pitch:

    5 mm

  • Terminal Shape:

    WIRE

16SEP150M+T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 16SEP150M+T is a rectangular pad with a size of 5.5mm x 3.5mm, with a solder mask opening of 4.5mm x 2.5mm.
  • To handle thermal considerations, ensure good thermal conductivity between the component and the PCB by using a thermal pad or a thermal interface material. Also, consider the thermal resistance of the component and the PCB when designing the thermal management system.
  • The maximum operating temperature range for the 16SEP150M+T is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
  • To ensure reliability in high-vibration applications, use a secure mounting method, such as soldering or adhesive bonding, and consider using a vibration-dampening material or a shock-absorbing mount to reduce the impact of vibrations on the component.
  • The recommended soldering conditions for the 16SEP150M+T are a peak temperature of 260°C, a soldering time of 3 seconds or less, and a preheating temperature of 120°C to 150°C.

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16SEP150M+T Overview

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