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16SEP330M - Panasonic

Description: Panasonic Aluminium Polymer Capacitor 330μF 16V dc 10mm F13 OS-CON Series, Through Hole Polymer, ±20% 10 (Dia.) x 13mm

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16SEP330M - Panasonic - PCB symbol
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PCB Footprints
16SEP330M - Panasonic PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - F13
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3D Models
16SEP330M - Panasonic - 3D model - Capacitor, Polarized Radial Diameter - F13
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16SEP330M Details

  • Manufacturer Part Number:

    16SEP330M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ-300KHZ

  • Capacitance:

    330 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    10 mm

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    16 mΩ

  • JESD-609 Code:

    e1

  • Leakage Current:

    0.792 mA

  • Length:

    13 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    BULK

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    16 V

  • Ripple Current:

    236 mA

  • Surface Mount:

    NO

  • Tan Delta:

    0.15

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Pitch:

    5 mm

  • Terminal Shape:

    WIRE

16SEP330M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 16SEP330M is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The 16SEP330M has a high power dissipation, so thermal considerations are crucial. Ensure good airflow around the component, and consider using a heat sink or thermal interface material to reduce thermal resistance. The recommended thermal pad size is 10mm x 10mm.
  • The recommended soldering profile for the 16SEP330M is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • To ensure the reliability of the 16SEP330M in high-vibration environments, use a robust mounting method such as screw mounting or adhesive bonding. Additionally, consider using a vibration-dampening material such as a silicone adhesive or a vibration-absorbing pad.
  • The 16SEP330M is an electrostatic discharge (ESD) sensitive device. Handle the component in an ESD-controlled environment, and use ESD-protective packaging and handling materials. Ground yourself before handling the component, and avoid touching the component's pins or leads.

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16SEP330M Overview

Use the download button to access the 16SEP330M schematic symbol, PCB footprint, and 3D model.
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