Description:Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness .8 MICM | Contact Type Socket | Wire Contact Termination Area Plating Thickness 31.49 MICIN | Mating Pin Diameter 1 MM | Wire Contact Termination Area Plating Thickness .8 MICM | Mating Pin Diameter .039 INCH | Contact Base Material Brass | Wire Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness 31.49 MICIN | Barrel Type Open | Contact Retention Wit
The recommended torque value is 0.5-0.7 Nm (4.4-6.3 in-lbs) for the screw terminals on the 170366-1 connector.
Yes, the 170366-1 connector is designed to withstand vibrations and is suitable for use in high-vibration environments, such as in industrial or transportation applications.
The operating temperature range for the 170366-1 connector is -40°C to 125°C (-40°F to 257°F).
Yes, the 170366-1 connector is designed for automated assembly and can be easily integrated into high-volume manufacturing processes.
The 170366-1 connector has a mating cycle life of 500 cycles, making it suitable for applications where frequent connections and disconnections are required.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
170366-1 Overview
Use the download button to access the 170366-1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 17036,
or try a keyword search, such as Assembly Items
About TE Connectivity
TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.
