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171982-0242 - Molex

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171982-0242 - Molex  - 3D model
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171982-0242 Details

  • Manufacturer Part Number:

    171982-0242

  • Part Life Cycle Code:

    Not Recommended

  • Reach Compliance Code:

    Compliant

  • Manufacturer:

    Molex

  • Board Mounting Option:

    PEG

  • Body Breadth:

    0.156 inch

  • Body Depth:

    0.354 inch

  • Body Length:

    0.53 inch

  • Body/Shell Style:

    RECEPTACLE

  • Connector Type:

    USB CONNECTOR

  • Contact Finish Mating:

    AU ON NI

  • Contact Gender:

    FEMALE

  • Contact Material:

    COPPER ALLOY

  • Contact Style:

    BELLOWED TYPE

  • Insulator Material:

    GLASS FILLED THERMOPLASTIC

  • Manufacturer Series:

    171982

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    2

  • PCB Contact Pattern:

    RECTANGULAR

  • PCB Contact Row Spacing:

    2.1844 mm

  • Plating Thickness:

    30u inch

  • Polarization Key:

    POLARIZED HOUSING

  • Reference Standard:

    UL

  • Reliability:

    COMMERCIAL

  • Shell Finish:

    TIN OVER NICKEL

  • Shell Material:

    STAINLESS STEEL

  • Subcategory:

    Telecom and Datacom Connectors

  • Terminal Pitch:

    0.508 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    42

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171982-0242 Overview

Use the download button to access the 171982-0242 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 17198, or try a keyword search, such as Telecom and Datacom Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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