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172065-0310 - Molex

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172065-0310 - Molex  - 3D model
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172065-0310 Details

  • Manufacturer Part Number:

    172065-0310

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    8

  • Additional Feature:

    RATED CURRENT(POWER): 23.5A; POLARIZED

  • Body Breadth:

    0.552 inch

  • Body Depth:

    0.583 inch

  • Body Length:

    1.148 inch

  • Connector Type:

    RECTANGULAR POWER CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Matte Tin (Sn)

  • Contact Gender:

    MALE

  • Contact Material:

    NOT SPECIFIED

  • Contact Style:

    SQ PIN-SKT

  • Empty Shell:

    NO

  • Filter Feature:

    NO

  • Insulator Material:

    LIQUID CRYSTAL POLYMER

  • JESD-609 Code:

    e3

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Type:

    BOARD

  • Operating Temperature-Max:

    120 °C

  • Operating Temperature-Min:

    -40 °C

  • Option:

    GENERAL PURPOSE

  • Packing Method:

    TRAY

  • Reference Standard:

    UL

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    10

  • UL Flammability Code:

    94V-0

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172065-0310 Overview

Use the download button to access the 172065-0310 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 17206, or try a keyword search, such as Power Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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