Description:Contact Features: Contact Mating Area Plating Material Thickness 5.08 MICM | Mating Pin Diameter .13 INCH | PCB Contact Termination Area Plating Material Thickness 200 MICIN | PCB Contact Termination Area Plating Material Silver | Contact Mating Area Plating Material Thickness 200 MICIN | Contact Mating Area Plating Material Silver | Contact Current Rating (Max) 35 AMP | Contact Underplating Material Thickness 50 MICM | Contact Underplating Material Thickness 1.27 MICIN | Contact Retention Within Housing Wi
Use the download button to access the 1766817-1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 17668,
or try a keyword search, such as Assembly Items
About TE Connectivity
TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.
