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1ED020I12FA2 - Infineon

Description: Gate Drivers DRIVER-IC

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1ED020I12FA2 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-20
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1ED020I12FA2 - Infineon  - 3D model - Small Outline Packages - PG-DSO-20
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1ED020I12FA2 Details

  • Manufacturer Part Number:

    1ED020I12FA2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Germany, Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • High Side Driver:

    YES

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    HALF BRIDGE BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.19 µs

  • Turn-on Time:

    0.195 µs

  • Width:

    7.62 mm

1ED020I12FA2 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C. Implement adequate cooling measures, such as heat sinks or fans, to maintain a safe operating temperature.
  • The 1ED020I12FA2 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the 1ED020I12FA2 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured in accordance with Infineon's quality and reliability standards.
  • Infineon recommends soldering the device using a reflow soldering process with a peak temperature of 260°C for 20-30 seconds. Ensure that the soldering process is performed in accordance with the IPC-J-STD-020 standard.

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1ED020I12FA2 Overview

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