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1EDI20I12AFXUMA1 - Infineon

Description: Driver 4A 1-OUT High Side Inv/Non-Inv 8-Pin DSO T/R

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1EDI20I12AFXUMA1 - Infineon PCB footprint - Other - Other - 1EDI20I12AFXUMA1-3
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1EDI20I12AFXUMA1 Details

  • Manufacturer Part Number:

    1EDI20I12AFXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    35 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.33 µs

  • Turn-on Time:

    0.33 µs

  • Width:

    3.9 mm

1EDI20I12AFXUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • To ensure EMC, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead to filter out electromagnetic interference (EMI).
  • The maximum allowed voltage on the input pins is 30V, but it's recommended to keep it below 20V to ensure reliable operation and prevent damage to the device.
  • The 1EDI20I12AFXUMA1 is rated for operation up to 150°C, but it's recommended to derate the device's performance at high temperatures to ensure reliability and prevent thermal runaway.
  • Check the input voltage, output load, and PCB layout for any issues. Use an oscilloscope to measure the output voltage and check for any noise or oscillations. Consult the datasheet and application notes for troubleshooting guidelines.

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1EDI20I12AFXUMA1 Overview

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