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1EDI60I12AF - Infineon

Description: Gate Drivers DRIVER IC

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1EDI60I12AF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - DSO-8
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1EDI60I12AF Details

  • Manufacturer Part Number:

    1EDI60I12AF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    ALSO HAS SINK O/P CURRENT OF 9.4A

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    PUSH-PULL BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    10 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    35 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.33 µs

  • Turn-on Time:

    0.33 µs

  • Width:

    3.9 mm

1EDI60I12AF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 1EDI60I12AF is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal design and layout guidelines, and to implement adequate cooling mechanisms to prevent overheating.
  • The recommended PCB layout and thermal design for the 1EDI60I12AF can be found in the Infineon application note AN2013-01, which provides detailed guidelines for optimal thermal performance.
  • Yes, the 1EDI60I12AF is designed to operate up to 1200V, making it suitable for high-voltage applications. However, it's essential to ensure that the device is properly configured and protected to prevent overvoltage and overcurrent conditions.
  • To protect the 1EDI60I12AF from ESD, it's essential to follow proper handling and storage procedures, and to implement ESD protection measures such as using ESD-safe materials, grounding straps, and ionizers.

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