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1EDN7550UXTSA1 - Infineon

Description: IC GATE DRVR HIGH-SIDE 6XFDFN

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1EDN7550UXTSA1 - Infineon - PCB symbol
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PCB Footprints
1EDN7550UXTSA1 - Infineon PCB footprint - Other - Other - TSNP-6
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3D Models
1EDN7550UXTSA1 - Infineon - 3D model - Other - TSNP-6
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1EDN7550UXTSA1 Details

  • Manufacturer Part Number:

    1EDN7550UXTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSNP-6

  • Country Of Origin:

    Germany, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • High Side Driver:

    YES

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    1.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    8 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.055 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    1.1 mm

1EDN7550UXTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded.
  • Yes, the 1EDN7550UXTSA1 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • Start by checking the power supply and input voltage, then verify the device is properly soldered and the PCB is free of defects. Use a oscilloscope to check the output waveform and verify it meets the datasheet specifications.

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1EDN7550UXTSA1 Overview

Use the download button to access the 1EDN7550UXTSA1 schematic symbol, PCB footprint, and 3D model.
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