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1EDS5663HXUMA1 - Infineon

Description: INFINEON - 1EDS5663HXUMA1 - MOSFET DRIVER, -40 TO 85DEG C

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1EDS5663HXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-16-30
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1EDS5663HXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-16-30
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1EDS5663HXUMA1 Details

  • Manufacturer Part Number:

    1EDS5663HXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    30 Weeks

  • Date Of Intro:

    2018-11-09

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    8 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    3.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    6.5 V

  • Supply Voltage1-Nom:

    8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.044 µs

  • Turn-on Time:

    0.044 µs

  • Width:

    7.5 mm

1EDS5663HXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2014-03, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • Infineon provides EMC guidelines in the application note AN2013-03, which includes recommendations for PCB design, component selection, and shielding to minimize electromagnetic interference.
  • According to Infineon's handling and assembly guidelines, the maximum allowed voltage stress on the device is 100 V for a maximum of 1 second, and 50 V for a maximum of 10 seconds.
  • Yes, the 1EDS5663HXUMA1 is qualified according to AEC-Q101, which makes it suitable for automotive and high-reliability applications. However, additional testing and validation may be required depending on the specific application.
  • Infineon provides a troubleshooting guide in the application note AN2015-01, which includes a step-by-step approach to identifying and resolving common issues with the device.

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