1N3020
Obsolete
DO-13
HERMETIC SEALED, GLASS PACKAGE-1
2
EAR99
8541.10.00.50
Microsemi Corporation (now Microchip)
0
METALLURGICALLY BONDED
ISOLATED
| Part Number |
|---|
| 1N4154 |
| ADG736 |
| MCP4531-103E/MS |
| MCP4651-502E/ST |
| SJ-43514-SMT-TR |
| HCPL-2631-000E |
| HCPL-2631-500E |
| SN65HVD230QDRQ1 |
| SN65HVD233DR |
| TLP291(V4GBTP,SE(T |