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1N4691 - Microsemi Corporation

Description: Zener Diodes Zener Diodes

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1N4691 - Microsemi Corporation PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO – 35
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1N4691 - Microsemi Corporation  - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO – 35
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1N4691 Details

  • Manufacturer Part Number:

    1N4691

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HERMETIC SEALED, GLASS, DO-7, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    METALLURGICALLY BONDED

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JEDEC-95 Code:

    DO-204AA

  • JESD-30 Code:

    O-LALF-W2

  • JESD-609 Code:

    e0

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    200 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.417 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    6.2 V

  • Reverse Current-Max:

    10 µA

  • Surface Mount:

    NO

  • Technology:

    ZENER

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    0.05 mA

1N4691 Frequently Asked Questions (FAQs)

  • The recommended mounting pad layout for the 1N4691 is a rectangular pad with a minimum size of 0.05 inches x 0.05 inches (1.27 mm x 1.27 mm) and a maximum size of 0.1 inches x 0.1 inches (2.54 mm x 2.54 mm). The pad should be centered on the device and have a non-solder-mask-defined (NSMD) pad shape.
  • The 1N4691 is a sensitive device and requires proper ESD protection during handling and assembly. It is recommended to use an ESD wrist strap or mat, and to handle the device by the body or leads, rather than the glass diode itself. Additionally, the device should be stored in an anti-static bag or container when not in use.
  • The maximum allowable voltage derating for the 1N4691 is 10% of the rated voltage. This means that if the device is rated for 1000V, the maximum allowable voltage derating would be 100V. Exceeding this derating may result in reduced reliability or failure of the device.
  • The 1N4691 is a general-purpose diode and is not optimized for high-frequency applications. While it can be used in high-frequency circuits, its performance may be limited by its internal capacitance and inductance. For high-frequency applications, a diode with a lower capacitance and inductance, such as a Schottky diode, may be a better choice.
  • The power dissipation rating of the 1N4691 can be determined by using the following formula: Pd = (TJ - TA) / RθJA, where Pd is the power dissipation, TJ is the junction temperature, TA is the ambient temperature, and RθJA is the thermal resistance from junction to ambient. The maximum power dissipation rating for the 1N4691 is 1.5W.

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