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1N6097 - GeneSiC Semiconductor

Description: DIODE SCHOTTKY 30V 50A DO5

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Symbol
1N6097 - GeneSiC Semiconductor - PCB symbol
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PCB Footprints
1N6097 - GeneSiC Semiconductor PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - SCHD
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3D Models
1N6097 - GeneSiC Semiconductor - 3D model - Diodes, Axial Diameter Horizontal Mounting - SCHD
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1N6097 Details

  • Manufacturer Part Number:

    1N6097

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    GeneSic Semiconductor Inc

  • YTEOL:

    5

  • Application:

    POWER

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JEDEC-95 Code:

    DO-203AB

  • JESD-30 Code:

    O-MUPM-D1

  • Non-rep Pk Forward Current-Max:

    800 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    50 A

  • Package Body Material:

    METAL

  • Package Shape:

    ROUND

  • Package Style:

    Post / Stud Mount

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    1000 µA

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    SOLDER LUG

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

1N6097 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the device, using a large copper area for heat dissipation, and keeping the thermal path as short as possible. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves, ensure good thermal management, and avoid exceeding the maximum junction temperature (Tj) of 175°C.
  • The 1N6097 has an internal ESD protection diode, but it is still recommended to follow standard ESD handling procedures when handling the device. A human body model (HBM) of 2 kV and a machine model (MM) of 200 V are recommended.
  • Yes, the 1N6097 can be used in switching applications, but it is essential to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range.
  • The recommended storage and handling procedure for the 1N6097 involves storing the devices in their original packaging, avoiding exposure to moisture, and following standard handling procedures for ESD-sensitive devices.

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1N6097 Overview

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