1N759 - Microsemi Corporation

1N759 Details

• Manufacturer Part Number:

  1N759

• Part Life Cycle Code:

  Transferred

• Part Package Code:

  DO-7

• Package Description:

  HERMETIC SEALED, GLASS PACKAGE-2

• Pin Count:

  2

• ECCN Code:

  EAR99

• HTS Code:

  8541.10.00.50

• Manufacturer:

  Microsemi Corporation (now Microchip)

• Additional Feature:

  METALLURGICALLY BONDED

• Case Connection:

  ISOLATED

• Configuration:

  SINGLE

• Diode Element Material:

  SILICON

• Diode Type:

  ZENER DIODE

• Dynamic Impedance-Max:

  30 Ω

• JEDEC-95 Code:

  DO-35

• JESD-30 Code:

  O-LALF-W2

• JESD-609 Code:

  e0

• Moisture Sensitivity Level:

  1

• Number of Elements:

  1

• Number of Terminals:

  2

• Operating Temperature-Max:

  175 °C

• Package Body Material:

  GLASS

• Package Shape:

  ROUND

• Package Style:

  LONG FORM

• Polarity:

  UNIDIRECTIONAL

• Power Dissipation-Max:

  0.5 W

• Qualification Status:

  Not Qualified

• Reference Voltage-Nom:

  12 V

• Surface Mount:

  NO

• Technology:

  ZENER

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  WIRE

• Terminal Position:

  AXIAL

• Voltage Tol-Max:

  10%

• Working Test Current:

  20 mA