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1P1G125QDCKRQ1 - Texas Instruments

Description: Automotive Catalog Single Bus Buffer Gate With 3-State Output

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1P1G125QDCKRQ1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC70 DCK 5
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1P1G125QDCKRQ1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - SC70 DCK 5
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1P1G125QDCKRQ1 Details

  • Manufacturer Part Number:

    1P1G125QDCKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    5

  • Direct Group:

    LG0107000C3U

  • Similar Group:

    LG0110011001100310161134

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    5.1 ns

  • Propagation Delay (tpd):

    5.1 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn); Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

1P1G125QDCKRQ1 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal pad is connected to a solid copper area on the PCB to improve heat dissipation.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow proper PCB design and layout guidelines, including providing adequate thermal relief, using a solid ground plane, and minimizing thermal resistance. Additionally, ensure that the device is operated within the recommended voltage and current specifications.
  • To mitigate EMI and RFI, it is recommended to use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure that the PCB layout is designed to minimize radiation and that the device is operated within the recommended frequency range.
  • To troubleshoot issues related to output voltage regulation, first, verify that the input voltage is within the recommended range. Check the output voltage using an oscilloscope or a multimeter to ensure it is within the specified tolerance. If the issue persists, check the feedback loop components, including the resistors and capacitors, to ensure they are within the recommended values.
  • To prevent damage, it is recommended to store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to extreme temperatures, humidity, or physical stress. When handling the devices, use ESD-protective equipment and follow proper handling procedures to prevent damage from static electricity.

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1P1G125QDCKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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