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1SG085HN2F43E2VGS - Intel

Description: series Field Programmable Gate Array (FPGA) IC 1760-BBGA, FCBGA

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1SG085HN2F43E2VGS - Intel PCB footprint - BGA - BGA - 1760-pin FBGA - Flip Chip - Step Top
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1SG085HN2F43E2VGS - Intel  - 3D model - BGA - 1760-pin FBGA - Flip Chip - Step Top
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1SG085HN2F43E2VGS Details

  • Manufacturer Part Number:

    1SG085HN2F43E2VGS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    BGA, BGA1760,42X42,40

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A001.A.7.B

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1760

  • Length:

    42.5 mm

  • Number of CLBs:

    105125

  • Number of Inputs:

    704

  • Number of Logic Cells:

    841000

  • Number of Outputs:

    704

  • Number of Terminals:

    1760

  • Operating Temperature-Max:

    100 °C

  • Organization:

    105125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1760,42X42,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.881 mm

  • Supply Voltage-Max:

    0.97 V

  • Supply Voltage-Min:

    0.77 V

  • Supply Voltage-Nom:

    0.8 V

  • Surface Mount:

    YES

  • Technology:

    14 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    42.5 mm

1SG085HN2F43E2VGS Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the 1SG085HN2F43E2VG, which includes recommendations for PCB layout, thermal design, and heat sink selection. It's essential to follow these guidelines to ensure optimal performance and prevent overheating.
  • The 1SG085HN2F43E2VG requires a specific power sequencing and voltage regulation scheme. Intel recommends using a dedicated power management IC (PMIC) or a custom power supply design that meets the device's power requirements. Consult Intel's application notes and design guides for more information.
  • The 1SG085HN2F43E2VG has specific operating conditions, such as temperature, voltage, and current limits. Ensure reliable operation by following Intel's recommended operating conditions, and implement proper thermal management, voltage regulation, and current limiting measures.
  • Intel provides debugging tools and guidelines for troubleshooting the 1SG085HN2F43E2VG. Common failure modes include overheating, power supply issues, and signal integrity problems. Use Intel's debugging resources, such as the Intel FPGA Debug Toolkit, to identify and resolve issues.
  • The 1SG085HN2F43E2VG has built-in security features, such as secure boot and firmware update mechanisms. Implement secure boot by following Intel's guidelines, and use secure firmware update protocols to ensure the integrity of the device's firmware.

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1SG085HN2F43E2VGS Overview

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Part Image 1SG085HN2F43E2VG Intel Corporation

Field Programmable Gate Array, 841000-Cell, PBGA1760