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1SG085HN3F43I3VG - Intel

Description: FPGA - Field Programmable Gate Array

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1SG085HN3F43I3VG - Intel PCB footprint - BGA - BGA - 1760-pin FBGA - Flip Chip - Step Top
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3D Models
1SG085HN3F43I3VG - Intel  - 3D model - BGA - 1760-pin FBGA - Flip Chip - Step Top
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1SG085HN3F43I3VG Details

  • Manufacturer Part Number:

    1SG085HN3F43I3VG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1760

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A001.A.7.B

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1760

  • Length:

    42.5 mm

  • Number of CLBs:

    105125

  • Number of Inputs:

    704

  • Number of Logic Cells:

    841000

  • Number of Outputs:

    704

  • Number of Terminals:

    1760

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    105125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1760,42X42,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.881 mm

  • Supply Voltage-Max:

    0.97 V

  • Supply Voltage-Min:

    0.77 V

  • Supply Voltage-Nom:

    0.8 V

  • Surface Mount:

    YES

  • Technology:

    14 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    42.5 mm

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1SG085HN3F43I3VG Overview

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