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1SMA5921BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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1SMA5921BT3G - onsemi - PCB symbol
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PCB Footprints
1SMA5921BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D-02
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1SMA5921BT3G - onsemi - 3D model - Diodes Moulded - SMA CASE 403D-02
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1SMA5921BT3G Details

  • Manufacturer Part Number:

    1SMA5921BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    2.5 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    200 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    6.8 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    5.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    55.1 mA

1SMA5921BT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the 1SMA5921BT3G involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the anode to a voltage source through a current-limiting resistor, and connect the cathode to ground through a low-impedance path. The recommended bias voltage is 5V to 12V, and the recommended bias current is 1mA to 10mA.
  • The maximum allowable power dissipation for the 1SMA5921BT3G is 500mW. Exceeding this limit can cause the device to overheat and fail.
  • Yes, the 1SMA5921BT3G is suitable for high-reliability applications. It is built with a rugged design and is qualified to automotive and industrial standards. However, it's essential to follow proper design and manufacturing guidelines to ensure the device meets the required reliability standards.
  • To prevent ESD damage, handle the 1SMA5921BT3G with an anti-static wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or leads, and use ESD-safe packaging and storage materials.

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1SMA5921BT3G Overview

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