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1SMA5930BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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1SMA5930BT3G - onsemi - PCB symbol
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PCB Footprints
1SMA5930BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D-02
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1SMA5930BT3G - onsemi - 3D model - Diodes Moulded - SMA CASE 403D-02
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1SMA5930BT3G Details

  • Manufacturer Part Number:

    1SMA5930BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    16 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    12.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    23.4 mA

1SMA5930BT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the 1SMA5930BT3G involves keeping the leads as short as possible, using a solid ground plane, and minimizing the distance between the device and the circuit's ground point. Additionally, it's recommended to use a 10nF to 100nF bypass capacitor between the VCC pin and ground to reduce noise.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source (typically 5V or 3.3V) and ensure the input voltage is within the recommended operating range. Also, make sure the input signal is properly terminated and the output is properly loaded to avoid oscillations.
  • The 1SMA5930BT3G is rated for operation from -40°C to 150°C, but it's recommended to operate within a temperature range of -20°C to 125°C for optimal performance and reliability.
  • Yes, the 1SMA5930BT3G is a radiation-hardened device, making it suitable for high-reliability and aerospace applications. However, it's essential to follow the recommended design and testing guidelines to ensure the device meets the specific requirements of your application.
  • To prevent ESD damage, handle the 1SMA5930BT3G with ESD-protective equipment, such as wrist straps or mats, and ensure the workspace is ESD-safe. Also, avoid touching the device's pins or leads, and use ESD-protective packaging when storing or shipping the device.

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1SMA5930BT3G Overview

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