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1SMB5954BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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1SMB5954BT3G - onsemi - PCB symbol
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PCB Footprints
1SMB5954BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03
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3D Models
1SMB5954BT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03
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1SMB5954BT3G Details

  • Manufacturer Part Number:

    1SMB5954BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    700 Ω

  • JESD-30 Code:

    R-PDSO-L2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    160 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    2.3 mA

1SMB5954BT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the 1SMB5954BT3G involves keeping the leads as short as possible, using a ground plane, and minimizing the distance between the device and the power source. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device.
  • The 1SMB5954BT3G can operate safely within a temperature range of -55°C to 150°C, but the recommended operating temperature range is -40°C to 125°C for optimal performance and reliability.
  • Yes, the 1SMB5954BT3G is suitable for high-reliability applications due to its robust design and manufacturing process. However, it's essential to follow proper design and assembly guidelines to ensure the device operates within its specified parameters.
  • To prevent ESD damage, handle the 1SMB5954BT3G with an anti-static wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or leads, and use ESD-safe packaging and storage materials.

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1SMB5954BT3G Overview

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1SMB5954BT3G Alternates

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Part Image 1SMB5954BT3 onsemi

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Part Image HSMBJ5954BE3TR Microsemi Corporation (now Microchip)

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For a full list of alternate parts for 1SMB5954BT3G, check out Findchips.com