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1SMC24AT3G - LITTELFUSE

Description: TVS DIODE 24VWM 38.9VC SMC

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1SMC24AT3G - LITTELFUSE  - 3D model
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1SMC24AT3G Details

  • Manufacturer Part Number:

    1SMC24AT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMC, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    29.5 V

  • Breakdown Voltage-Min:

    26.7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.75 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

1SMC24AT3G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 1SMC24AT3G is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask defined around it.
  • The 1SMC24AT3G has a thermal resistance of 25°C/W. To handle thermal considerations, ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider using a heat sink or thermal interface material if necessary.
  • The maximum surge current rating for the 1SMC24AT3G is 3000A, with a waveform of 10/1000μs.
  • Yes, the 1SMC24AT3G is suitable for high-reliability applications. It is designed and manufactured to meet the requirements of AEC-Q101, which ensures high reliability and robustness in harsh environments.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. Use a soldering time of 2-3 seconds, and ensure the component is properly aligned with the PCB pads.

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1SMC24AT3G Overview

Use the download button to access the 1SMC24AT3G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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