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1SMC28AT3G - onsemi

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Symbol
1SMC28AT3G - onsemi - PCB symbol
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PCB Footprints
1SMC28AT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE403-03
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3D Models
1SMC28AT3G - onsemi - 3D model - Diodes Moulded - SMC CASE403-03
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1SMC28AT3G Details

  • Manufacturer Part Number:

    1SMC28AT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403-03, SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    34.4 V

  • Breakdown Voltage-Min:

    31.1 V

  • Breakdown Voltage-Nom:

    32.75 V

  • Clamping Voltage-Max:

    45.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.75 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    28 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

1SMC28AT3G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 1SMC28AT3G is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a solder mask opening of 0.3 mm x 0.3 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The thermal pad of the 1SMC28AT3G should be connected to a copper plane on the PCB to ensure good thermal dissipation. A thermal via or a thermal pad on the PCB is recommended to connect the thermal pad of the device to the copper plane.
  • The maximum operating temperature range for the 1SMC28AT3G is -40°C to 150°C. However, the device is typically specified for operation from -40°C to 125°C. Operation outside this range may affect the device's performance and reliability.
  • The 1SMC28AT3G requires a bias voltage of 5V to 24V to operate correctly. A stable voltage source with minimal noise and ripple is recommended. Additionally, a decoupling capacitor of 10 uF to 100 uF should be placed close to the device to ensure proper operation.
  • The maximum surge current rating for the 1SMC28AT3G is 3000 W for 10/1000 μs. This rating is based on the device's ability to withstand high-energy surges without damage.

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1SMC28AT3G Overview

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