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1SMC30AT3G - onsemi

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PCB Footprints
1SMC30AT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE403-03
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1SMC30AT3G - onsemi  - 3D model - Diodes Moulded - SMC CASE403-03
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1SMC30AT3G Details

  • Manufacturer Part Number:

    1SMC30AT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403-03, SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    36.8 V

  • Breakdown Voltage-Min:

    33.3 V

  • Breakdown Voltage-Nom:

    35.05 V

  • Clamping Voltage-Max:

    48.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.75 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

1SMC30AT3G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 1SMC30AT3G is a rectangular pad with a size of 0.8mm x 1.2mm, with a solder mask opening of 0.6mm x 0.8mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The thermal pad on the 1SMC30AT3G should be connected to a copper plane on the PCB to help dissipate heat. A thermal via or a thermal pad on the PCB is recommended to improve heat dissipation.
  • The maximum operating temperature range for the 1SMC30AT3G is -55°C to 150°C. However, the device is typically specified for operation from -40°C to 125°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The recommended storage condition for the 1SMC30AT3G is in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C to 30°C, and the humidity should be less than 60%.

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1SMC30AT3G Overview

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