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1SMC30AT3G - onsemi

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1SMC30AT3G - onsemi  - 3D model
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1SMC30AT3G Details

  • Manufacturer Part Number:

    1SMC30AT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403-03, SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403-03

  • Similar Group:

    DI1010069133

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    36.8 V

  • Breakdown Voltage-Min:

    33.3 V

  • Breakdown Voltage-Nom:

    35.05 V

  • Clamping Voltage-Max:

    48.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.75 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

1SMC30AT3G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 1SMC30AT3G is a rectangular pad with a size of 0.8mm x 1.2mm, with a solder mask opening of 0.6mm x 0.8mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The thermal pad on the 1SMC30AT3G should be connected to a copper plane on the PCB to help dissipate heat. A thermal via or a thermal pad on the PCB is recommended to improve heat dissipation.
  • The maximum operating temperature range for the 1SMC30AT3G is -55°C to 150°C. However, the device is typically specified for operation from -40°C to 125°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The recommended storage condition for the 1SMC30AT3G is in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C to 30°C, and the humidity should be less than 60%.

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1SMC30AT3G Overview

Use the download button to access the 1SMC30AT3G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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